I1730SY01 vs ISD4004-12MEY feature comparison

I1730SY01 Winbond Electronics Corp

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ISD4004-12MEY Nuvoton Technology Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP NUVOTON TECHNOLOGY CORP
Part Package Code SOIC TSOP
Package Description SOP, TSOP1, TSSOP28,.53,22
Pin Count 28 28
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-PDSO-G28
JESD-609 Code e3
Length 17.93 mm 11.8 mm
Number of Functions 1 1
Number of Terminals 28 28
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 60 s 720 s
Seated Height-Max 2.64 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.3 V
Supply Voltage-Min (Vsup) 2.4 V 2.7 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.55 mm
Terminal Position DUAL DUAL
Width 7.52 mm 8 mm
Base Number Matches 1 2
Package Equivalence Code TSSOP28,.53,22
Supply Current-Max 40 mA
Technology CMOS

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