I17180XYIR
vs
I17180XY01
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
DIE
DIE
Package Description
DIE,
DIE,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
X-XUUC-N
X-XUUC-N
Number of Functions
1
1
On Chip Memory Type
FLASH
FLASH
Operating Temperature-Max
85 °C
50 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
UNSPECIFIED
UNSPECIFIED
Package Style
UNCASED CHIP
UNCASED CHIP
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
360 s
360 s
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Base Number Matches
1
1
Compare I17180XYIR with alternatives
Compare I17180XY01 with alternatives