I17180XY01
vs
I17150PYI01
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
DIE
DIP
Package Description
DIE,
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
X-XUUC-N
R-PDIP-T28
Number of Functions
1
1
On Chip Memory Type
FLASH
FLASH
Operating Temperature-Max
50 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
DIP
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
360 s
300 s
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Surface Mount
YES
NO
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Base Number Matches
1
1
Pin Count
28
JESD-609 Code
e3
Length
36.83 mm
Number of Terminals
28
Package Equivalence Code
DIP28,.6
Seated Height-Max
4.83 mm
Terminal Finish
MATTE TIN
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare I17180XY01 with alternatives
Compare I17150PYI01 with alternatives