I17180XY01
vs
ISD4002-150X
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
| Part Package Code |
DIE
|
DIE
|
| Package Description |
DIE,
|
DIE,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
| JESD-30 Code |
X-XUUC-N
|
R-XUUC-N19
|
| Number of Functions |
1
|
1
|
| On Chip Memory Type |
FLASH
|
FLASH
|
| Operating Temperature-Max |
50 °C
|
50 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
DIE
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reading Time-Max |
360 s
|
150 s
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.3 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Pin Count |
|
19
|
| JESD-609 Code |
|
e0
|
| Number of Terminals |
|
19
|
| Package Equivalence Code |
|
DIE OR CHIP
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare I17180XY01 with alternatives
Compare ISD4002-150X with alternatives