HYE18P64160AF-12.5 vs MT45W4MW16BBB706LIT feature comparison

HYE18P64160AF-12.5 Infineon Technologies AG

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MT45W4MW16BBB706LIT Micron Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description VFBGA, 6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, LEAD FREE, VFBGA-54
Pin Count 54 54
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
JESD-30 Code R-PBGA-B54 R-PBGA-B54
Length 8 mm 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type PSEUDO STATIC RAM PSEUDO STATIC RAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 54 54
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 6 mm 6 mm
Base Number Matches 1 2
Rohs Code Yes
Access Time-Max 70 ns
JESD-609 Code e1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

Compare HYE18P64160AF-12.5 with alternatives

Compare MT45W4MW16BBB706LIT with alternatives