HYE18P64160AF-12.5 vs MT45W4ML16BBB-708WT feature comparison

HYE18P64160AF-12.5 Infineon Technologies AG

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MT45W4ML16BBB-708WT Micron Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description VFBGA, VFBGA, BGA54,6X9,30
Pin Count 54 54
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
JESD-30 Code R-PBGA-B54 R-PBGA-B54
Length 8 mm 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type PSEUDO STATIC RAM PSEUDO STATIC RAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 54 54
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 6 mm 6 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Access Time-Max 70 ns
I/O Type COMMON
JESD-609 Code e1
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Output Characteristics 3-STATE
Package Equivalence Code BGA54,6X9,30
Peak Reflow Temperature (Cel) 260
Standby Current-Max 0.00012 A
Supply Current-Max 0.035 mA
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER

Compare HYE18P64160AF-12.5 with alternatives

Compare MT45W4ML16BBB-708WT with alternatives