HYB25D256163CE-4
vs
MT48LC32M8A2FB-6AIT
feature comparison
| Part Life Cycle Code |
Transferred
|
Contact Manufacturer
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
MICRON TECHNOLOGY INC
|
| Part Package Code |
TSOP2
|
|
| Package Description |
TSOP2,
|
FBGA, BGA60,8X15,32
|
| Pin Count |
66
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.24
|
|
| Access Mode |
FOUR BANK PAGE BURST
|
|
| Access Time-Max |
0.6 ns
|
5.4 ns
|
| Additional Feature |
AUTO/SELF REFRESH
|
|
| JESD-30 Code |
R-PDSO-G66
|
R-PBGA-B60
|
| Length |
22.22 mm
|
|
| Memory Density |
268435456 bit
|
268435456 bit
|
| Memory IC Type |
DDR DRAM
|
SYNCHRONOUS DRAM
|
| Memory Width |
16
|
8
|
| Number of Functions |
1
|
|
| Number of Ports |
1
|
|
| Number of Terminals |
66
|
60
|
| Number of Words |
16777216 words
|
33554432 words
|
| Number of Words Code |
16000000
|
32000000
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
16MX16
|
32MX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP2
|
FBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
GRID ARRAY, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
|
| Self Refresh |
YES
|
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
|
| Supply Voltage-Nom (Vsup) |
2.6 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
10.16 mm
|
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Clock Frequency-Max (fCLK) |
|
167 MHz
|
| I/O Type |
|
COMMON
|
| Interleaved Burst Length |
|
1,2,4,8
|
| Moisture Sensitivity Level |
|
1
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
BGA60,8X15,32
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Power Supplies |
|
3.3 V
|
| Refresh Cycles |
|
8192
|
| Sequential Burst Length |
|
1,2,4,8,FP
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare HYB25D256163CE-4 with alternatives
Compare MT48LC32M8A2FB-6AIT with alternatives