HY62SF16806A-DM85I vs CY62157DV30LL-55BVIT feature comparison

HY62SF16806A-DM85I SK Hynix Inc

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CY62157DV30LL-55BVIT Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description VFBGA, BGA48,6X8,30
Pin Count 48
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 85 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0
Length 8.5 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA FBGA
Package Equivalence Code BGA48,6X8,30 BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.95 mm
Standby Voltage-Min 1.2 V 1.5 V
Supply Current-Max 0.025 mA 0.015 mA
Supply Voltage-Max (Vsup) 2.3 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 7.4 mm
Base Number Matches 1 1
Pbfree Code No
Standby Current-Max 0.000004 A

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Compare CY62157DV30LL-55BVIT with alternatives