HY62SF16806A-DM85C
vs
CY62157CV30LL-55BAI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
VFBGA, BGA48,6X8,30
6 X 10 MM, 1.20 MM HEIGHT, FBGA-48
Pin Count
48
48
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
85 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
e0
Length
8.5 mm
10 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX16
512KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Equivalence Code
BGA48,6X8,30
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.95 mm
1.2 mm
Standby Voltage-Min
1.2 V
1.5 V
Supply Current-Max
0.025 mA
0.025 mA
Supply Voltage-Max (Vsup)
2.3 V
3.3 V
Supply Voltage-Min (Vsup)
1.7 V
2.7 V
Supply Voltage-Nom (Vsup)
1.8 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
7.4 mm
6 mm
Base Number Matches
1
2
Standby Current-Max
0.00002 A
Compare HY62SF16806A-DM85C with alternatives
Compare CY62157CV30LL-55BAI with alternatives