HY62256BLLP-85I vs EDI8832P85CB feature comparison

HY62256BLLP-85I SK Hynix Inc

Buy Now Datasheet

EDI8832P85CB Electronic Designs Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC ELECTRONIC DESIGNS INC
Part Package Code DIP
Package Description DIP, DIP28,.6
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 85 ns 85 ns
Additional Feature BATTERY BACKUP
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T28 R-CDIP-T28
JESD-609 Code e0 e0
Length 37 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.826 mm
Standby Current-Max 0.00002 A 0.00025 A
Standby Voltage-Min 2 V 4.5 V
Supply Current-Max 0.06 mA 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 1
Screening Level 38535Q/M;38534H;883B

Compare HY62256BLLP-85I with alternatives

Compare EDI8832P85CB with alternatives