HY27UA161G1M-FEB
vs
EN29LV640U-70RWC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
SK HYNIX INC
ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
Part Package Code
BGA
Package Description
TFBGA,
TFBGA, BGA63,8X12,32
Pin Count
63
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
12000 ns
70 ns
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
Length
15 mm
12 mm
Memory Density
1073741824 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
63
63
Number of Words
67108864 words
4194304 words
Number of Words Code
64000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-25 °C
Organization
64MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3.3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.05 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
SLC NAND TYPE
NOR TYPE
Width
8.5 mm
11 mm
Base Number Matches
1
2
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
Number of Sectors/Size
128
Package Equivalence Code
BGA63,8X12,32
Ready/Busy
YES
Sector Size
32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.03 mA
Toggle Bit
YES
Compare HY27UA161G1M-FEB with alternatives
Compare EN29LV640U-70RWC with alternatives