HY27SG162G2M-SPIB
vs
NAND02GW3B2AN1F
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SK HYNIX INC
|
MICRON TECHNOLOGY INC
|
Part Package Code |
SOIC
|
TSOP
|
Package Description |
VSSOP, TSSOP48,.71,20
|
TSSOP,
|
Pin Count |
48
|
48
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
30 ns
|
35 ns
|
Command User Interface |
YES
|
|
Data Polling |
NO
|
|
JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
Length |
15.4 mm
|
18.4 mm
|
Memory Density |
2147483648 bit
|
2147483648 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
8
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
2K
|
|
Number of Terminals |
48
|
48
|
Number of Words |
134217728 words
|
268435456 words
|
Number of Words Code |
128000000
|
256000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
128MX16
|
256MX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP48,.71,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Page Size |
1K words
|
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
1.8 V
|
3 V
|
Qualification Status |
Not Qualified
|
|
Ready/Busy |
YES
|
|
Seated Height-Max |
0.65 mm
|
1.2 mm
|
Sector Size |
64K
|
|
Standby Current-Max |
0.0001 A
|
|
Supply Current-Max |
0.02 mA
|
0.03 mA
|
Supply Voltage-Max (Vsup) |
1.95 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Toggle Bit |
NO
|
|
Type |
SLC NAND TYPE
|
NAND TYPE
|
Width |
12 mm
|
12 mm
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e3
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare HY27SG162G2M-SPIB with alternatives
Compare NAND02GW3B2AN1F with alternatives