HY23V16202S-120
vs
K3P5U1000F-GC12
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP44,.63
SOP, SOP44,.63
Pin Count
44
44
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
120 ns
120 ns
Alternate Memory Width
8
8
JESD-30 Code
R-PDSO-G44
R-PDSO-G44
Length
28.5 mm
28.5 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP44,.63
SOP44,.63
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.2 mm
3.1 mm
Standby Current-Max
0.00005 A
0.00003 A
Supply Current-Max
0.035 mA
0.05 mA
Supply Voltage-Max (Vsup)
3.6 V
3.3 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
12.6 mm
12.6 mm
Base Number Matches
1
2
Rohs Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare HY23V16202S-120 with alternatives
Compare K3P5U1000F-GC12 with alternatives