HY23V08200D-120 vs K3P4U1000D-DC12 feature comparison

HY23V08200D-120 SK Hynix Inc

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K3P4U1000D-DC12 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP42,.6
Pin Count 42 42
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 80 ns 120 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDIP-T42 R-PDIP-T42
Length 52.451 mm 52.42 mm
Memory Density 67108864 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.826 mm 5.08 mm
Supply Current-Max 0.035 mA 0.035 mA
Supply Voltage-Max (Vsup) 3.6 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 2 1
Rohs Code No
Additional Feature CONFIGURABLE AS 512K X 16
JESD-609 Code e0
Package Equivalence Code DIP42,.6
Standby Current-Max 0.00003 A
Terminal Finish TIN LEAD

Compare HY23V08200D-120 with alternatives

Compare K3P4U1000D-DC12 with alternatives