HVC0805H3284DTFP
vs
HVCG0805DBC3M28
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
OHMCRAFT
|
STACKPOLE ELECTRONICS INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Rectangular
|
| JESD-609 Code |
e3
|
e4
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.64 mm
|
0.64 mm
|
| Package Length |
2.01 mm
|
2.01 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.27 mm
|
1.27 mm
|
| Rated Power Dissipation (P) |
0.2 W
|
0.2 W
|
| Resistance |
3280000 Ω
|
3280000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Series |
HVC
|
|
| Size Code |
0805
|
0805
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
50 ppm/°C
|
50 ppm/°C
|
| Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
GOLD
|
| Tolerance |
0.5%
|
0.5%
|
| Working Voltage |
600 V
|
600 V
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
SMT, 0805
|
| HTS Code |
|
8533.21.00.30
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Packing Method |
|
BULK
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare HVC0805H3284DTFP with alternatives
Compare HVCG0805DBC3M28 with alternatives