HV758FB-G
vs
HV758FB
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
SUPERTEX INC
|
SUPERTEX INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
FBGA,
|
FBGA,
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
S-PBGA-B64
|
S-PBGA-B64
|
| JESD-609 Code |
e3
|
e0
|
| Length |
8 mm
|
8 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.45 mm
|
1.97 mm
|
| Supply Voltage-Max |
12.6 V
|
12.6 V
|
| Supply Voltage-Min |
7.5 V
|
7.5 V
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
1
|
2
|
|
|
|