HSM8100J/TR13
vs
HSM8100G
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
SMCJ, 2 PIN
|
R-PDSO-G2
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
20 Weeks
|
|
| Additional Feature |
FREE WHEELING DIODE, LOW LEAKAGE CURRENT, LOW POWER LOSS
|
FREE WHEELING DIODE, LOW LEAKAGE CURRENT, LOW POWER LOSS
|
| Application |
EFFICIENCY
|
EFFICIENCY
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.78 V
|
0.78 V
|
| JEDEC-95 Code |
DO-214AB
|
DO-215AB
|
| JESD-30 Code |
R-PDSO-C2
|
R-PDSO-G2
|
| Non-rep Pk Forward Current-Max |
300 A
|
300 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Current-Max |
8 A
|
8 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Reverse Current-Max |
500 µA
|
500 µA
|
| Reverse Test Voltage |
100 V
|
100 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Form |
C BEND
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
DO-215AB
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
| JESD-609 Code |
|
e3
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare HSM8100J/TR13 with alternatives
Compare HSM8100G with alternatives