HSDL-1100#S07
vs
HSDL-1100#S07
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
AVAGO TECHNOLOGIES INC
|
HEWLETT PACKARD CO
|
Package Description |
,
|
,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
JESD-30 Code |
R-XDMA-T10
|
R-XDMA-X10
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
10
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Equivalence Code |
MODULE,10LEAD(UNSPEC)
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
5.25 V
|
|
Supply Voltage-Min |
4.75 V
|
|
Supply Voltage-Nom |
5 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
UNSPECIFIED
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
|
|
|