HS1-26CLV31RH-Q vs 5962F9666302V9A feature comparison

HS1-26CLV31RH-Q Renesas Electronics Corporation

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5962F9666302V9A Intersil Corporation

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Pbfree Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP INTERSIL CORP
Part Package Code SBDIP DIE
Package Description DIP, DIE, DIE OR CHIP
Pin Count 16 16
Manufacturer Package Code D16.3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Renesas Electronics
Differential Output YES YES
Driver Number of Bits 4 4
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422 EIA-422
JESD-30 Code R-CDIP-T16 R-XUUC-N16
JESD-609 Code e4 e4
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class V MIL-PRF-38535 Class V
Seated Height-Max 5.08 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish GOLD GOLD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Total Dose 300k Rad(Si) V 300k Rad(Si) V
Width 7.62 mm
Base Number Matches 1 1
Rohs Code Yes
High Level Input Current-Max 0.000001 A
Out Swing-Min 1.8 V
Output Characteristics 3-STATE
Package Equivalence Code DIE OR CHIP
Receive Delay-Max
Transmit Delay-Max 42 ns

Compare HS1-26CLV31RH-Q with alternatives

Compare 5962F9666302V9A with alternatives