HPA01195YFPR vs BQ51013YFFT feature comparison

HPA01195YFPR Texas Instruments

Buy Now Datasheet

BQ51013YFFT Texas Instruments

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Package Description VFBGA, DSBGA-28
Reach Compliance Code compliant compliant
JESD-30 Code R-PBGA-B28 R-XBGA-B28
JESD-609 Code e1 e1
Length 3 mm 2.76 mm
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Seated Height-Max 0.5 mm 0.625 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.4 mm 0.4 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.88 mm 1.56 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code BGA
Pin Count 28
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Qualification Status Not Qualified

Compare HPA01195YFPR with alternatives

Compare BQ51013YFFT with alternatives