HPA01195YFPR
vs
BQ51013YFFT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
End Of Life
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Package Description
VFBGA,
DSBGA-28
Reach Compliance Code
compliant
compliant
JESD-30 Code
R-PBGA-B28
R-XBGA-B28
JESD-609 Code
e1
e1
Length
3 mm
2.76 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
28
28
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
VFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Seated Height-Max
0.5 mm
0.625 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
TELECOM CIRCUIT
TELECOM CIRCUIT
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.4 mm
0.4 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.88 mm
1.56 mm
Base Number Matches
1
1
Pbfree Code
Part Package Code
BGA
Pin Count
28
ECCN Code
EAR99
HTS Code
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Qualification Status
Not Qualified
Compare HPA01195YFPR with alternatives
Compare BQ51013YFFT with alternatives