BQ51013YFFT
vs
HPA02221RHLR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
End Of Life
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
Package Description
DSBGA-28
HVQCCN,
Pin Count
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
JESD-30 Code
R-XBGA-B28
R-PQCC-N20
JESD-609 Code
e1
Length
2.76 mm
4.5 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
28
20
Operating Temperature-Max
125 °C
Operating Temperature-Min
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VFBGA
HVQCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
0.625 mm
1 mm
Supply Voltage-Nom
5 V
Surface Mount
YES
YES
Telecom IC Type
TELECOM CIRCUIT
TELECOM CIRCUIT
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
NO LEAD
Terminal Pitch
0.4 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
1.56 mm
3.5 mm
Base Number Matches
1
1
Compare BQ51013YFFT with alternatives
Compare HPA02221RHLR with alternatives