HN62W4416NFB-15 vs K3N5U1000D-GC15 feature comparison

HN62W4416NFB-15 Hitachi Ltd

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K3N5U1000D-GC15 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HITACHI LTD SAMSUNG SEMICONDUCTOR INC
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 44 44
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 200 ns 150 ns
Additional Feature USER CONFIGURABLE AS 1M X 16; PAGE ACCESS TIME = 50NS CONFIGURABLE AS 1M X 16
JESD-30 Code R-PDSO-G44 R-PDSO-G44
Length 28.5 mm 28.5 mm
Memory Density 4194304 bit 16777216 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX8 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm 3.1 mm
Supply Current-Max 0.07 mA 0.04 mA
Supply Voltage-Max (Vsup) 5.5 V 3.3 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 12.6 mm 12.6 mm
Base Number Matches 1 1
Rohs Code No
Alternate Memory Width 8
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

Compare HN62W4416NFB-15 with alternatives

Compare K3N5U1000D-GC15 with alternatives