HN62414TFP-15
vs
KM23C4100AFP1-15
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
HITACHI LTD
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
TQFP,
|
WQFP, QFP44,.7SQ,32
|
Pin Count |
44
|
44
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
150 ns
|
150 ns
|
Alternate Memory Width |
16
|
16
|
JESD-30 Code |
S-PQFP-G44
|
S-CQFP-G44
|
Length |
14 mm
|
14 mm
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
MASK ROM
|
MASK ROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
44
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
512KX8
|
512KX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
TQFP
|
WQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, THIN PROFILE
|
FLATPACK, WINDOW
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
2.8 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
QFP44,.7SQ,32
|
Standby Current-Max |
|
0.00005 A
|
Supply Current-Max |
|
0.05 mA
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare HN62414TFP-15 with alternatives
Compare KM23C4100AFP1-15 with alternatives