HN62331AP
vs
SST39SF010A-70-4C-PHE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HITACHI LTD
SILICON STORAGE TECHNOLOGY INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP32,.6
ROHS COMPLIANT, PLASTIC, MO-015AP, DIP-32
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.51
Access Time-Max
120 ns
70 ns
JESD-30 Code
R-PDIP-T32
R-PDIP-T32
JESD-609 Code
e0
e3
Length
41.9 mm
41.91 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
MASK ROM
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX8
128KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP32,.6
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Standby Current-Max
0.00003 A
0.0001 A
Supply Current-Max
0.05 mA
0.035 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
2
2
Command User Interface
YES
Data Polling
YES
Number of Sectors/Size
32
Peak Reflow Temperature (Cel)
260
Programming Voltage
5 V
Sector Size
4K
Toggle Bit
YES
Type
NOR TYPE
Compare HN62331AP with alternatives
Compare SST39SF010A-70-4C-PHE with alternatives