HN623257P vs HM23C256 feature comparison

HN623257P Hitachi Ltd

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HM23C256 Hualon Microelectronics Corp

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HITACHI LTD HUALON MICROELECTRONICS CORP
Part Package Code DIP DIP
Package Description DIP, DIP28,.6 DIP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 120 ns
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0
Length 35.6 mm 36.703 mm
Memory Density 262144 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min -20 °C
Organization 32KX8 512KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.7 mm 6.35 mm
Standby Current-Max 0.00003 A
Supply Current-Max 0.045 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 4
Additional Feature NON POWER DOWN VERSION

Compare HN623257P with alternatives

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