HN58X2404SFPI
vs
HN58X2404SFPIAGE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Not Recommended
Ihs Manufacturer
HITACHI LTD
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP8,.25
3.90 X 4.89 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
Data Retention Time-Min
10
10
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
I2C Control Byte
1010DDMR
1010DDMR
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
4.9 mm
4.89 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512X8
512X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.73 mm
Serial Bus Type
I2C
I2C
Standby Current-Max
0.000003 A
0.000003 A
Supply Current-Max
0.003 mA
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Write Cycle Time-Max (tWC)
15 ms
15 ms
Write Protection
HARDWARE
HARDWARE
Base Number Matches
2
1
Pbfree Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HN58X2404SFPI with alternatives
Compare HN58X2404SFPIAGE with alternatives