HMU16GM-45/883
vs
IDT7216L25P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
3A991.A.2
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT; ICC SPECIFIED @ 1MHZ
Boundary Scan
NO
NO
Clock Frequency-Max
22.22 MHz
40 MHz
External Data Bus Width
16
16
JESD-30 Code
S-CPGA-P68
R-PDIP-T64
JESD-609 Code
e0
e0
Low Power Mode
YES
YES
Number of Terminals
68
64
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Data Bus Width
32
32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
PGA
DIP
Package Equivalence Code
PGA68,11X11
DIP64,.9
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Supply Current-Max
7 mA
200 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
PIN/PEG
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
DUAL
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, MULTIPLIER
DSP PERIPHERAL, MULTIPLIER
Base Number Matches
1
2
Part Package Code
DIP
Package Description
0.900 INCH, PLASTIC, DIP-64
Pin Count
64
Length
81.534 mm
Seated Height-Max
5.842 mm
Width
22.86 mm
Compare HMU16GM-45/883 with alternatives
Compare IDT7216L25P with alternatives