HMU16GC-35 vs IDT7216L55J feature comparison

HMU16GC-35 Intersil Corporation

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IDT7216L55J Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PGA LCC
Package Description CERAMIC, PGA-68 PLASTIC, LCC-68
Pin Count 68 68
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT; ICC SPECIFIED AT 1MHZ 2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT; ICC SPECIFIED @ 18.18MHZ
Boundary Scan NO NO
External Data Bus Width 16 16
JESD-30 Code S-CPGA-P68 S-PQCC-J68
JESD-609 Code e0 e0
Length 29.465 mm 24.2062 mm
Low Power Mode YES NO
Number of Terminals 68 68
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Data Bus Width 32 16
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code PGA QCCJ
Package Equivalence Code PGA68,11X11 LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style GRID ARRAY CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.2 mm 4.57 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form PIN/PEG J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position PERPENDICULAR QUAD
Width 29.465 mm 24.2062 mm
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, MULTIPLIER DSP PERIPHERAL, MULTIPLIER
Base Number Matches 1 2
Clock Frequency-Max 18.18 MHz
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Supply Current-Max 80 mA
Time@Peak Reflow Temperature-Max (s) 20

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