HMS30C7202
vs
MC9328MX1DVM20
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SK HYNIX INC
MOTOROLA INC
Part Package Code
BGA
Package Description
LBGA,
14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, MAPBGA-256
Pin Count
256
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
25
25
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
14 mm
Low Power Mode
YES
NO
Number of Terminals
256
256
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
-30 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.6 mm
Speed
82.944 MHz
200 MHz
Supply Voltage-Max
2.7 V
2 V
Supply Voltage-Min
2.3 V
1.8 V
Supply Voltage-Nom
2.5 V
1.9 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
17 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
5
Clock Frequency-Max
16 MHz
Package Equivalence Code
BGA256,16X16,32
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