HMS30C7202
vs
XPC850DEZT50BU
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
MAGNACHIP SEMICONDUCTOR LTD
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-256
BGA-256
Pin Count
256
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
25
26
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
23 mm
Low Power Mode
YES
YES
Number of Terminals
256
256
Operating Temperature-Max
85 °C
95 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
2.35 mm
Speed
82.944 MHz
50 MHz
Supply Voltage-Max
2.7 V
3.465 V
Supply Voltage-Min
2.3 V
3.135 V
Supply Voltage-Nom
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
17 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
4
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