HM6AEB18202BPL50 vs IS61DDP2B21M36A-400B4L feature comparison

HM6AEB18202BPL50 Renesas Electronics Corporation

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IS61DDP2B21M36A-400B4L Integrated Silicon Solution Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Contact Manufacturer Active
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description 15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165 LBGA,
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0
Length 17 mm 15 mm
Memory Density 37748736 bit 37748736 bit
Memory IC Type DDR SRAM DDR SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 1048576 words
Number of Words Code 2000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX18 1MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.46 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.9 V 1.89 V
Supply Voltage-Min (Vsup) 1.7 V 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 13 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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Compare IS61DDP2B21M36A-400B4L with alternatives