HM6AEB18202BPL50 vs IBM0436A41QLAB-3P feature comparison

HM6AEB18202BPL50 Renesas Electronics Corporation

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IBM0436A41QLAB-3P IBM

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description 15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165 BGA, BGA119,7X17,50
Pin Count 165 119
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 1.5 ns
JESD-30 Code R-PBGA-B165 R-PBGA-B119
JESD-609 Code e0 e0
Length 17 mm 22 mm
Memory Density 37748736 bit 4718592 bit
Memory IC Type DDR SRAM STANDARD SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 2097152 words 131072 words
Number of Words Code 2000000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Organization 2MX18 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.46 mm 2.679 mm
Supply Voltage-Max (Vsup) 1.9 V 3.63 V
Supply Voltage-Min (Vsup) 1.7 V 3.135 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 14 mm
Base Number Matches 1 1
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Standby Current-Max 0.1 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.47 mA

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Compare IBM0436A41QLAB-3P with alternatives