HM6AEB18202BPL50
vs
AS7C332MNTF18A-85BCN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
ALLIANCE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165
TBGA,
Pin Count
165
165
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
JESD-30 Code
R-PBGA-B165
JESD-609 Code
e0
Length
17 mm
Memory Density
37748736 bit
Memory IC Type
DDR SRAM
Memory Width
18
Number of Functions
1
Number of Terminals
165
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
2MX18
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
1.46 mm
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
15 mm
Base Number Matches
1
1
Compare HM6AEB18202BPL50 with alternatives
Compare AS7C332MNTF18A-85BCN with alternatives