HM66AEB36104BP-30 vs IS61DDP2B21M36A-400B4L feature comparison

HM66AEB36104BP-30 Renesas Electronics Corporation

Buy Now Datasheet

IS61DDP2B21M36A-400B4L Integrated Silicon Solution Inc

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer RENESAS TECHNOLOGY CORP INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 LBGA,
Pin Count 165 165
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Clock Frequency-Max (fCLK) 333 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 17 mm 15 mm
Memory Density 37748736 bit 37748736 bit
Memory IC Type DDR SRAM DDR SRAM
Memory Width 36 36
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX36 1MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.46 mm 1.4 mm
Standby Current-Max 0.35 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.88 mA
Supply Voltage-Max (Vsup) 1.9 V 1.89 V
Supply Voltage-Min (Vsup) 1.7 V 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 13 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare HM66AEB36104BP-30 with alternatives

Compare IS61DDP2B21M36A-400B4L with alternatives