HM66AEB18205BP-30
vs
MCM69R821AZP4.2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
BGA
Package Description
LBGA, BGA165,11X15,40
BGA, BGA119,7X17,50
Pin Count
165
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
0.45 ns
5.5 ns
Clock Frequency-Max (fCLK)
333 MHz
I/O Type
SEPARATE
COMMON
JESD-30 Code
R-PBGA-B165
R-PBGA-B119
JESD-609 Code
e1
e0
Length
17 mm
Memory Density
37748736 bit
4718592 bit
Memory IC Type
DDR SRAM
LATE-WRITE SRAM
Memory Width
18
18
Number of Functions
1
Number of Terminals
165
119
Number of Words
2097152 words
262144 words
Number of Words Code
2000000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX18
256KX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA165,11X15,40
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.46 mm
Standby Current-Max
0.35 A
Standby Voltage-Min
1.7 V
3.15 V
Supply Current-Max
0.9 mA
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
YES
Technology
CMOS
BICMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
Base Number Matches
1
3
Rohs Code
Power Supplies
1.5,3.3 V
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