HM66AEB18205BP-30
vs
CY7C1381AV25-117AC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
QFP
Package Description
LBGA, BGA165,11X15,40
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Pin Count
165
100
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
7.5 ns
Clock Frequency-Max (fCLK)
333 MHz
I/O Type
SEPARATE
COMMON
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
JESD-609 Code
e1
e0
Length
17 mm
20 mm
Memory Density
37748736 bit
18874368 bit
Memory IC Type
DDR SRAM
STANDARD SRAM
Memory Width
18
36
Number of Functions
1
1
Number of Terminals
165
100
Number of Words
2097152 words
524288 words
Number of Words Code
2000000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX18
512KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LQFP
Package Equivalence Code
BGA165,11X15,40
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.46 mm
1.6 mm
Standby Current-Max
0.35 A
0.015 A
Standby Voltage-Min
1.7 V
2.38 V
Supply Current-Max
0.9 mA
0.25 mA
Supply Voltage-Max (Vsup)
1.9 V
2.625 V
Supply Voltage-Min (Vsup)
1.7 V
2.375 V
Supply Voltage-Nom (Vsup)
1.8 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn/Pb)
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Width
15 mm
14 mm
Base Number Matches
1
1
Rohs Code
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Compare CY7C1381AV25-117AC with alternatives