HM66AEB18205BP-30 vs 71V2546XS150BGG8 feature comparison

HM66AEB18205BP-30 Renesas Electronics Corporation

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71V2546XS150BGG8 Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS TECHNOLOGY CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LBGA, BGA165,11X15,40 BGA,
Pin Count 165 119
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 3.8 ns
Clock Frequency-Max (fCLK) 333 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B119
JESD-609 Code e1 e1
Length 17 mm 22 mm
Memory Density 37748736 bit 4718592 bit
Memory IC Type DDR SRAM ZBT SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 2097152 words 131072 words
Number of Words Code 2000000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX18 128KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.46 mm 2.36 mm
Standby Current-Max 0.35 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.9 mA
Supply Voltage-Max (Vsup) 1.9 V 3.465 V
Supply Voltage-Min (Vsup) 1.7 V 3.135 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 14 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Additional Feature PIPELINED ARCHITECTURE
Moisture Sensitivity Level 3

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