HM62Y8128DLTSI-12UL
vs
8959808BUC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
AUSTIN SEMICONDUCTOR INC
Part Package Code
TSOP1
DLCC
Package Description
TSOP1,
SON,
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
120 ns
70 ns
JESD-30 Code
R-PDSO-G32
R-CDSO-N32
Length
11.8 mm
20.955 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
128KX8
128KX8
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
TSOP1
SON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
2.54 mm
Supply Voltage-Max (Vsup)
3.3 V
5.5 V
Supply Voltage-Min (Vsup)
2.3 V
4.5 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
8 mm
10.16 mm
Base Number Matches
2
1
JESD-609 Code
e4
Number of Ports
1
Output Characteristics
3-STATE
Output Enable
YES
Standby Voltage-Min
2 V
Terminal Finish
PALLADIUM GOLD
Compare HM62Y8128DLTSI-12UL with alternatives
Compare 8959808BUC with alternatives