HM62V8512CLFP-7
vs
WMS512K8-17FFM
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MICROSEMI CORP
|
| Part Package Code |
SOIC
|
DFP
|
| Package Description |
SOP,
|
CERAMIC, DFP-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
70 ns
|
17 ns
|
| JESD-30 Code |
R-PDSO-G32
|
R-CDFP-F32
|
| Length |
20.45 mm
|
21.82 mm
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Organization |
512KX8
|
512KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3 mm
|
2.9972 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
11.3 mm
|
10.8712 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| Additional Feature |
|
LG-MAX
|
| JESD-609 Code |
|
e4
|
| Terminal Finish |
|
GOLD
|
|
|
|
Compare HM62V8512CLFP-7 with alternatives
Compare WMS512K8-17FFM with alternatives