HM62V8512CLFP-7 vs DPS512X8MKN3-30B feature comparison

HM62V8512CLFP-7 Renesas Electronics Corporation

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DPS512X8MKN3-30B B&B Electronics Manufacturing Company

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP DPAC TECHNOLOGIES CORP
Part Package Code SOIC MODULE
Package Description SOP, DIP, DIP32,.6
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 30 ns
JESD-30 Code R-PDSO-G32 R-XDMA-T32
Length 20.45 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -20 °C -55 °C
Organization 512KX8 512KX8
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 11.3 mm
Base Number Matches 2 1
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES
Package Equivalence Code DIP32,.6
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.0018 A
Standby Voltage-Min 2 V
Supply Current-Max 0.18 mA
Terminal Finish Tin/Lead (Sn/Pb)

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