Part Details for DPS512X8MKN3-30B by B&B Electronics Manufacturing Company
Overview of DPS512X8MKN3-30B by B&B Electronics Manufacturing Company
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DPS512X8MKN3-30B
DPS512X8MKN3-30B CAD Models
DPS512X8MKN3-30B Part Data Attributes
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DPS512X8MKN3-30B
B&B Electronics Manufacturing Company
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Datasheet
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DPS512X8MKN3-30B
B&B Electronics Manufacturing Company
SRAM Module, 512KX8, 30ns, CMOS, STACK, DIP-32
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | DPAC TECHNOLOGIES CORP | |
| Part Package Code | MODULE | |
| Package Description | DIP, DIP32,.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 30 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-XDMA-T32 | |
| JESD-609 Code | e0 | |
| Memory Density | 4194304 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512KX8 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | 38535Q/M;38534H;883B | |
| Standby Current-Max | 0.0018 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.18 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for DPS512X8MKN3-30B
This table gives cross-reference parts and alternative options found for DPS512X8MKN3-30B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS512X8MKN3-30B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DPS512X8MKN3-30M | SRAM Module, 512KX8, 30ns, CMOS, STACK, DIP-32 | Twilight Technology Inc | DPS512X8MKN3-30B vs DPS512X8MKN3-30M |
| DPS512X8MKN3-30I | SRAM Module, 512KX8, 30ns, CMOS, STACK, DIP-32 | Twilight Technology Inc | DPS512X8MKN3-30B vs DPS512X8MKN3-30I |
| DPS512X8MKN3-30I | SRAM Module, 512KX8, 30ns, CMOS, STACK, DIP-32 | B&B Electronics Manufacturing Company | DPS512X8MKN3-30B vs DPS512X8MKN3-30I |
| DPS512X8MKN3-30C | SRAM Module, 512KX8, 30ns, CMOS, STACK, DIP-32 | Twilight Technology Inc | DPS512X8MKN3-30B vs DPS512X8MKN3-30C |