HM62V16512LBPI-7 vs HY62SF16804A-DM85C feature comparison

HM62V16512LBPI-7 Renesas Electronics Corporation

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HY62SF16804A-DM85C SK Hynix Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer RENESAS TECHNOLOGY CORP SK HYNIX INC
Part Package Code BGA BGA
Package Description TFBGA, VFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 85 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 9.8 mm 8.5 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 0.95 mm
Supply Voltage-Max (Vsup) 3.6 V 2.3 V
Supply Voltage-Min (Vsup) 2.7 V 1.7 V
Supply Voltage-Nom (Vsup) 3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 6.5 mm 7.4 mm
Base Number Matches 2 1
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Standby Voltage-Min 1.2 V
Supply Current-Max 0.025 mA
Terminal Finish TIN LEAD

Compare HM62V16512LBPI-7 with alternatives

Compare HY62SF16804A-DM85C with alternatives