HM62V16512LBPI-7
vs
CY62157DV30LL-55BVXI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
TFBGA,
6 X 8 MM, 1 MM HEIGHT, LEAD FREE, FBGA-48
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
55 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
9.8 mm
8 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.2 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
6.5 mm
6 mm
Base Number Matches
2
1
Rohs Code
I/O Type
COMMON
JESD-609 Code
e1
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
BGA48,6X8,30
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.000004 A
Standby Voltage-Min
1.5 V
Supply Current-Max
0.015 mA
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
20
Compare HM62V16512LBPI-7 with alternatives
Compare CY62157DV30LL-55BVXI with alternatives