HM62V16256CLBP-7SL
vs
M5M5Y416CWG-55HI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MITSUBISHI ELECTRIC CORP
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA48,6X8,30
BGA, BGA48,6X8,30
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
55 ns
Additional Feature
ALSO OPERATES AT 3.0V SUPPLY VOLTAGE
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
e0
Length
6.5 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-20 °C
-40 °C
Organization
256KX16
256KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
BGA
Package Equivalence Code
BGA48,6X8,30
BGA48,6X8,30
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Standby Voltage-Min
2 V
1.3 V
Supply Current-Max
0.025 mA
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
2.3 V
Supply Voltage-Min (Vsup)
2.2 V
1.65 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
6.5 mm
Base Number Matches
2
2
Rohs Code
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