HM4-65262B-2:RD
vs
AM100470ADCB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MATRA MHS
ADVANCED MICRO DEVICES INC
Package Description
,
DIP, DIP18,.3
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
25 ns
JESD-30 Code
R-CQCC-N20
R-GDIP-T18
Memory Density
16384 bit
4096 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
20
18
Number of Words
16384 words
4096 words
Number of Words Code
16000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
Organization
16KX1
4KX1
Output Characteristics
3-STATE
OPEN-EMITTER
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
QCCN
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Standby Voltage-Min
2 V
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
NO
Technology
CMOS
ECL
Temperature Grade
MILITARY
OTHER
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
QUAD
DUAL
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
18
I/O Type
SEPARATE
JESD-609 Code
e0
Length
22.86 mm
Package Equivalence Code
DIP18,.3
Seated Height-Max
5.08 mm
Supply Current-Max
0.2 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare HM4-65262B-2:RD with alternatives
Compare AM100470ADCB with alternatives