HM3-7610B5
vs
6301-1N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
Package Description
DIP, DIP16,.3
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
35 ns
JESD-30 Code
R-PDIP-T16
JESD-609 Code
e0
Memory Density
1024 bit
Memory IC Type
OTP ROM
Memory Width
4
Number of Terminals
16
Number of Words
256 words
Number of Words Code
256
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
256X4
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Qualification Status
Not Qualified
Supply Current-Max
0.13 mA
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
TTL
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Base Number Matches
1
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