HM1E-65764N-9 vs 5962R3829437SXX feature comparison

HM1E-65764N-9 Temic Semiconductors

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5962R3829437SXX Cobham Semiconductor Solutions

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer TEMIC SEMICONDUCTORS AEROFLEX COLORADO SPRINGS
Reach Compliance Code unknown unknown
Access Time-Max 55 ns 55 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.02 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Part Package Code DIP
Package Description DIP,
Pin Count 28
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Length 35.56 mm
Screening Level MIL-PRF-38535 Class V
Seated Height-Max 4.445 mm
Total Dose 100k Rad(Si) V
Width 15.24 mm

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