5962R3829437SXX vs 5962H3829437BXA feature comparison

5962R3829437SXX Cobham Semiconductor Solutions

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5962H3829437BXA Cobham Semiconductor Solutions

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer AEROFLEX COLORADO SPRINGS AEROFLEX COLORADO SPRINGS
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.1.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-GDIP-T28 R-GDIP-T28
Length 35.56 mm 35.56 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class V MIL-PRF-38534 Class H
Seated Height-Max 4.445 mm 4.445 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 100k Rad(Si) V 1M Rad(Si) V
Width 15.24 mm 15.24 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

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Compare 5962H3829437BXA with alternatives