HM1E-65764N/883 vs MT5C6408C-55/IT feature comparison

HM1E-65764N/883 Temic Semiconductors

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MT5C6408C-55/IT Micross Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEMIC SEMICONDUCTORS AUSTIN SEMICONDUCTOR INC
Reach Compliance Code unknown unknown
Access Time-Max 55 ns 55 ns
JESD-30 Code R-CDIP-T28 R-CDIP-T28
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 1
Rohs Code No
Part Package Code DIP
Package Description DIP, DIP28,.3
Pin Count 28
ECCN Code EAR99
HTS Code 8542.32.00.41
Additional Feature TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY
I/O Type COMMON
JESD-609 Code e0
Package Equivalence Code DIP28,.3
Seated Height-Max 5.715 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.145 mA
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare HM1E-65764N/883 with alternatives

Compare MT5C6408C-55/IT with alternatives