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Overview of MT5C6408C-55/IT by Micross Components
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for MT5C6408C-55/IT by Micross Components
Part Data Attributes for MT5C6408C-55/IT by Micross Components
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
AUSTIN SEMICONDUCTOR INC
|
Part Package Code
|
DIP
|
Package Description
|
DIP, DIP28,.3
|
Pin Count
|
28
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
55 ns
|
Additional Feature
|
TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-CDIP-T28
|
JESD-609 Code
|
e0
|
Memory Density
|
65536 bit
|
Memory IC Type
|
STANDARD SRAM
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
28
|
Number of Words
|
8192 words
|
Number of Words Code
|
8000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
8KX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code
|
DIP
|
Package Equivalence Code
|
DIP28,.3
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
5.715 mm
|
Standby Current-Max
|
0.02 A
|
Standby Voltage-Min
|
4.5 V
|
Supply Current-Max
|
0.145 mA
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|
Width
|
7.62 mm
|
Alternate Parts for MT5C6408C-55/IT
This table gives cross-reference parts and alternative options found for MT5C6408C-55/IT. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MT5C6408C-55/IT, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
HM1-65764N-5 | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28 | Matra MHS | MT5C6408C-55/IT vs HM1-65764N-5 |
6164-55/BXAJC | 8KX8 STANDARD SRAM, 55ns, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Motorola Mobility LLC | MT5C6408C-55/IT vs 6164-55/BXAJC |
MT5C6408C-55/XT | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Micross Components | MT5C6408C-55/IT vs MT5C6408C-55/XT |
7164S55TCB | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28 | Integrated Device Technology Inc | MT5C6408C-55/IT vs 7164S55TCB |
HM1-65764N/883 | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, | Temic Semiconductors | MT5C6408C-55/IT vs HM1-65764N/883 |
EDI8810L55DB | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, | Electronic Designs Inc | MT5C6408C-55/IT vs EDI8810L55DB |
IDT7164S55TCB | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, 0.300 INCH, THIN, SIDE BRAZED, DIP-28 | Integrated Device Technology Inc | MT5C6408C-55/IT vs IDT7164S55TCB |
EDI8810H55DB | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, | Electronic Designs Inc | MT5C6408C-55/IT vs EDI8810H55DB |
HM1E-65764N/883 | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, | Temic Semiconductors | MT5C6408C-55/IT vs HM1E-65764N/883 |
MT5C6408C-55/883C | Standard SRAM, 8KX8, 55ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Micross Components | MT5C6408C-55/IT vs MT5C6408C-55/883C |